Momwe Mungasankhire Surface Finish pa PCB Design Yanu
Ⅱ Kuwunika ndi Kufananiza
Adalemba: Nov 16, 2022
Magulu: Mabulogu
Tags: pcb,pcba,pcb msonkhano,kupanga pcb, pcb pamwamba kumaliza
Pali maupangiri ambiri okhudzana ndi kutha kwa pamwamba, monga HASL yopanda lead ili ndi vuto kukhala ndi kusalala kosasinthasintha.Electrolytic Ni/Au ndiyokwera mtengo kwambiri ndipo ngati golide wochulukira wayikidwa pa pad, zitha kupangitsa kuti ma brittle solder joints.Kumizidwa malata ali solderability kuwonongeka pambuyo kukhudzana ndi kangapo kutentha mkombero, monga pamwamba ndi pansi mbali PCBA reflow ndondomeko, etc.. Kusiyana pamwamba pamwamba akumaliza anafunika kudziwa bwino.Tebulo ili m'munsiyi likuwonetsa kuwunika kovutirapo kwa zomaliza zomwe zimagwiritsidwa ntchito pafupipafupi pama board osindikizidwa.
Table 1 Kufotokozera mwachidule za njira zopangira, zabwino ndi zoyipa, komanso kugwiritsa ntchito mawonekedwe odziwika bwino a PCB opanda lead.
| PCB Surface Finish | Njira | Makulidwe | Ubwino wake | Zoipa | Ntchito Zofananira |
| HASL yopanda kutsogolera | matabwa PCB kumizidwa mu chosungunuka malata osambira ndiyeno kuwomberedwa ndi mipeni mpweya otentha kwa pats lathyathyathya ndi owonjezera solder kuchotsa. | 30µin(1µm) -1500µin(40µm) | Good Solderability;Zopezeka kwambiri;Ikhoza kukonzedwa / kukonzedwanso;Utali wa alumali wautali | Malo osagwirizana;Kutentha kwa kutentha;Kunyowetsa bwino;Solder mlatho;Ma PTH olumikizidwa. | Zokwanira;Zoyenera pazitali zazikulu ndi matayala;Osayenerera HDI ndi <20 mil (0.5mm) phula labwino ndi BGA;Osati zabwino kwa PTH;Osati suti kwa wandiweyani mkuwa PCB;Nthawi zambiri, kugwiritsa ntchito: Ma board ozungulira oyesa magetsi, kuwotcherera m'manja, zida zamagetsi zogwira ntchito kwambiri monga zakuthambo ndi zida zankhondo. |
| OSP | Kupaka organic kowirikiti pamatabwa pamwamba kupanga organic zitsulo wosanjikiza kuteteza mkuwa woonekera kuti dzimbiri. | 46µin (1.15µm) -52µin(1.3µm) | Mtengo wotsika;Mapadi ndi yunifolomu ndi lathyathyathya;Solderability wabwino;Ikhoza kukhala ndi zigawo zina zomaliza;Njira ndi yosavuta;Ikhoza kusinthidwa (mkati mwa msonkhano). | Zomverera pogwira;Moyo wa alumali wamfupi.Kufalikira kochepa kwambiri kwa solder;Solderability kuwonongeka ndi okwera temp & mkombero;Nonconductive;Zovuta kuyang'ana, kufufuza kwa ICT, kukhudzidwa kwa ionic & press-fit | Zokwanira;Zokwanira bwino kwa SMT/miyendo yabwino/BGA/zigawo zing'onozing'ono;Kutumikira matabwa;Osati zabwino kwa PTHs;Osayenerera ukadaulo wa crimping |
| ENIG | Njira ya Chemical yomwe imayika mkuwa wowonekera ndi Nickel ndi Golide, motero imakhala ndi zokutira zazitsulo ziwiri. | 2µin (0.05µm)– 5µin (0.125µm) wa Golide woposa 120µin (3µm)– 240µin (6µm) wa Nickel | Wabwino solderability;Mapepala ndi ophwanyika komanso ofanana;Al waya bendability;Kukana kukhudzana kochepa;Moyo wautali wa alumali;Zabwino kukana dzimbiri komanso kulimba | "Black Pad" nkhawa;Kutayika kwa ma sign pakugwiritsa ntchito kukhulupirika kwa chizindikiro;osatha kukonzanso | Zabwino kwambiri pamisonkhano yamayimidwe abwino komanso kuyika kovutirapo pamwamba (BGA, QFP…);Zabwino kwambiri pamitundu yambiri ya Soldering;Zokonda za PTH, dinani zoyenera;Waya Bondable;Limbikitsani PCB ndi ntchito yodalirika kwambiri monga zakuthambo, asilikali, azachipatala ndi ogula apamwamba, etc.;Osavomerezeka pa Touch Contact Pads. |
| Electrolytic Ni/Au (Golide wofewa) | 99.99% yoyera - 24 carat Golide yoyikidwa pamwamba pa nickel wosanjikiza kudzera mu njira ya electrolytic pamaso pa soldermask. | 99.99% Golide weniweni, 24 Karat 30µin (0.8µm) -50µin (1.3µm) pamwamba pa 100µin (2.5µm) -200µin (5µm) wa Nickel | Pamwamba, yolimba;Great conductivity;Kusalala;Al waya bendability;Kukana kukhudzana kochepa;Moyo wautali wa alumali | Zokwera mtengo;Au embrittlement ngati wandiweyani kwambiri;Zolepheretsa kamangidwe;Kukonzekera kowonjezera / kugwira ntchito kwambiri;Osati suti ya soldering;Kupaka si yunifolomu | Amagwiritsidwa ntchito kwambiri pama waya (Al & Au) omangirira mu phukusi la chip monga COB (Chip on Board) |
| Electrolytic Ni/Au (Golide Wolimba) | 98% koyera - 23 carat Golide wokhala ndi zowumitsa zowonjezedwa kumadzi osamba omwe amagwiritsidwa ntchito pamwamba pa nickel wosanjikiza kudzera munjira ya electrolytic. | 98% Golide weniweni, 23 Karat30µin(0.8µm) -50µin(1.3µm) pamwamba pa 100µin(2.5µm) -150µin(4µm) wa Nickel | Wabwino solderability;Mapepala ndi ophwanyika komanso ofanana;Al waya bendability;Kukana kukhudzana kochepa;Zothekanso | Kuwononga (kusamalira & kusunga) dzimbiri m'malo okwera sulfure;Kuchepetsa zosankha zamtundu wapaintaneti kuti zithandizire kumaliza uku;Short ntchito zenera pakati pa msonkhano magawo. | Amagwiritsidwa ntchito kwambiri polumikizira magetsi monga zolumikizira m'mphepete (chala chagolide), matabwa onyamula IC (PBGA/FCBGA/FCCSP...), Makiyibodi, kulumikizana ndi batire ndi mapepala ena oyesera, ndi zina zambiri. |
| Kumiza Ag | siliva wosanjikiza amayikidwa pamtunda wamkuwa kudzera muzitsulo zopanda electroless plating pambuyo pa etch koma pamaso pa soldermask. | 5µin(0.12µm) -20µin(0.5µm) | Wabwino solderability;Mapepala ndi ophwanyika komanso ofanana;Al waya bendability;Kukana kukhudzana kochepa;Zothekanso | Kuwononga (kusamalira & kusunga) dzimbiri m'malo okwera sulfure;Kuchepetsa zosankha zamtundu wapaintaneti kuti zithandizire kumaliza uku;Short ntchito zenera pakati pa msonkhano magawo. | Njira ina yazachuma ku ENIG ya Fine Traces ndi BGA;Zoyenera kugwiritsa ntchito zizindikiro zothamanga kwambiri;Zabwino pakusintha kwa membrane, kutchingira kwa EMI, ndi kulumikizana ndi waya wa aluminiyamu;Oyenera press fit. |
| Kumiza Sn | Mumadzi osambira opanda ma elekitirodi, wosanjikiza woyera wopyapyala wa Tin amayika molunjika pama board ozungulira amkuwa ngati chotchinga chopewera okosijeni. | 25µin (0.7µm) -60µin(1.5µm) | Yabwino kwambiri paukadaulo wa atolankhani;Zotsika mtengo;Planar;Kugulitsa kwabwino (pakakhala kwatsopano) ndi kudalirika;Kusalala | Solderability kuwonongeka ndi okwera temps & m'zinthu;Zitini zowonekera pamisonkhano yomaliza zimatha kuwononga;Kuthana ndi mavuto;Tin Wiskering;Osayenerera PTH;Muli Thiourea, Carcinogen wodziwika. | Thandizani kupanga ndalama zambiri;Zabwino pakuyika kwa SMD, BGA;Zabwino kwa atolankhani ndi ndege zakumbuyo;Osavomerezeka kwa PTH, masiwichi olumikizana, ndikugwiritsa ntchito masks ovunda |
Table2 Kuwunika kwazinthu zamakono za PCB Surface Finishes pakupanga ndi kugwiritsa ntchito
| Kupanga zomaliza zomwe zimagwiritsidwa ntchito kwambiri | |||||||||
| Katundu | ENIG | ENEPIG | Golide Wofewa | Golide wolimba | IAg | ISn | HASL | Chithunzi cha HASL-LF | OSP |
| Kutchuka | Wapamwamba | Zochepa | Zochepa | Zochepa | Wapakati | Zochepa | Zochepa | Wapamwamba | Wapakati |
| Mtengo wa Njira | Pamwamba (1.3x) | Pamwamba (2.5x) | Chapamwamba (3.5x) | Chapamwamba (3.5x) | Zapakati (1.1x) | Zapakati (1.1x) | Pansi (1.0x) | Pansi (1.0x) | Chotsikitsitsa (0.8x) |
| Depositi | Kumiza | Kumiza | Electrolytic | Electrolytic | Kumiza | Kumiza | Kumiza | Kumiza | Kumiza |
| Shelf Life | Utali | Utali | Utali | Utali | Wapakati | Wapakati | Utali | Utali | Wachidule |
| Zogwirizana ndi RoHS | Inde | Inde | Inde | Inde | Inde | Inde | No | Inde | Inde |
| Surface Co-planarity ya SMT | Zabwino kwambiri | Zabwino kwambiri | Zabwino kwambiri | Zabwino kwambiri | Zabwino kwambiri | Zabwino kwambiri | Osauka | Zabwino | Zabwino kwambiri |
| Mkuwa Wowonekera | No | No | No | Inde | No | No | No | No | Inde |
| Kugwira | Wamba | Wamba | Wamba | Wamba | Zovuta | Zovuta | Wamba | Wamba | Zovuta |
| Khama la Njira | Wapakati | Wapakati | Wapamwamba | Wapamwamba | Wapakati | Wapakati | Wapakati | Wapakati | Zochepa |
| Kukonzanso Mphamvu | No | No | No | No | Inde | Osaperekedwa | Inde | Inde | Inde |
| Zofunika Matenthedwe Mayendedwe | zambiri | zambiri | zambiri | zambiri | zambiri | 2-3 | zambiri | zambiri | 2 |
| Nkhani ya whisky | No | No | No | No | No | Inde | No | No | No |
| Thermal Shock (PCB MFG) | Zochepa | Zochepa | Zochepa | Zochepa | Otsika Kwambiri | Otsika Kwambiri | Wapamwamba | Wapamwamba | Otsika Kwambiri |
| Kukana Kwambiri / Kuthamanga Kwambiri | No | No | No | No | Inde | No | No | No | N / A |
| Kugwiritsa ntchito zomaliza zomwe zimagwiritsidwa ntchito kwambiri | |||||||||
| Mapulogalamu | ENIG | ENEPIG | Golide Wofewa | Golide Wolimba | IAg | ISn | HASL | Mtengo wa LF-HASL | OSP |
| Wokhwima | Inde | Inde | Inde | Inde | Inde | Inde | Inde | Inde | Inde |
| Flex | Zoletsedwa | Zoletsedwa | Inde | Inde | Inde | Inde | Inde | Inde | Inde |
| Flex-Rigid | Inde | Inde | Inde | Inde | Inde | Inde | Inde | Inde | Osakondedwa |
| Fine Pitch | Inde | Inde | Inde | Inde | Inde | Inde | Osakondedwa | Osakondedwa | Inde |
| BGA & μBGA | Inde | Inde | Inde | Inde | Inde | Inde | Osakondedwa | Osakondedwa | Inde |
| Multiple Solderability | Inde | Inde | Inde | Inde | Inde | Inde | Inde | Inde | Zoletsedwa |
| Flip Chip | Inde | Inde | Inde | Inde | Inde | Inde | No | No | Inde |
| Dinani Fit | Zoletsedwa | Zoletsedwa | Zoletsedwa | Zoletsedwa | Inde | Zabwino kwambiri | Inde | Inde | Zoletsedwa |
| Kupyolera mu Hole | Inde | Inde | Inde | Inde | Inde | No | No | No | No |
| Kulumikiza Waya | Inde (Al) | Inde (Al, Au) | Inde (Al, Au) | Inde (Al) | Zosintha (Al) | No | No | No | Inde (Al) |
| Solder Wettability | Zabwino | Zabwino | Zabwino | Zabwino | Zabwino kwambiri | Zabwino | Osauka | Osauka | Zabwino |
| Solder Joint Integrity | Zabwino | Zabwino | Osauka | Osauka | Zabwino kwambiri | Zabwino | Zabwino | Zabwino | Zabwino |
Moyo wa alumali ndi chinthu chofunikira kwambiri chomwe muyenera kuganizira popanga ndandanda yanu yopanga.Shelf Lifendi zenera ntchito amene amapereka kutsiriza kukhala wathunthu PCB weldability.Ndikofunika kuwonetsetsa kuti ma PCB anu onse asonkhanitsidwa mkati mwa alumali.Kuphatikiza pa zinthu ndi ndondomeko zomwe zimapanga mapeto a pamwamba, nthawi ya alumali yomaliza imakhudzidwa kwambirindi PCBs ma CD ndi kusunga.Olemba mosamalitsa njira yosungiramo yoyenera yoperekedwa ndi malangizo a IPC-1601 aziteteza kutenthetsa ndi kudalirika komaliza.
Table3 Shelf life Kuyerekeza pakati pa Mapeto Odziwika Pamwamba pa PCB
|
| Moyo wofananira wa SHEL | Moyo Wa Shelufu Woperekedwa | Rework Chance |
| HASL-LF | Miyezi 12 | Miyezi 12 | INDE |
| OSP | Miyezi 3 | 1 Miyezi | INDE |
| ENIG | Miyezi 12 | 6 Miyezi | AYI* |
| ENEPIG | 6 Miyezi | 6 Miyezi | AYI* |
| Electrolytic Ni/Au | Miyezi 12 | Miyezi 12 | NO |
| IAg | 6 Miyezi | Miyezi 3 | INDE |
| ISn | 6 Miyezi | Miyezi 3 | INDE** |
* Kwa ENIG ndi ENEPIG akumaliza kuzungulira kwa kukonzanso kuti azitha kunyowa komanso moyo wa alumali ulipo.
** Chemical Tin rework sananene.
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