HDI PCB kupanga mu fakitale ya PCB yokha --- ENEPIG PCB pamwamba kumaliza
Adalemba:Feb 03, 2023
Magulu: Mabulogu
Tags: pcb,pcba,pcb msonkhano,kupanga pcb, pcb pamwamba kumaliza,HDI
ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) sizomaliza kugwiritsidwa ntchito kwa PCB pakadali pano pomwe yadziwika kwambiri m'makampani opanga PCB.Ndi ntchito kwa osiyanasiyana ntchito mwachitsanzo, zosiyanasiyana padziko phukusi ndi apamwamba kwambiri PCB matabwa.ENEPIG ndi mtundu wosinthidwa wa ENIG, ndikuwonjezera kwa Palladium wosanjikiza (0.1-0.5 µm/4 mpaka 20 μ'') pakati pa Nickel (3-6 µm/120 – 240 μ'') ndi Golide (0,02- 0,05 µm/1 mpaka 2 μ'') kudzera munjira yomiza mankhwala mu PCB fakitale.Palladium imagwira ntchito ngati chotchinga choteteza faifi tambala kuti isawonongeke ndi Au, zomwe zimathandiza kupewa "pad yakuda" kuti isachitike yomwe ili vuto lalikulu kwa ENIG.
Ngati palibe kugwirizana kwa bajeti, ENEPIG ikuwoneka ngati njira yabwinoko pazinthu zambiri makamaka zofunika kwambiri zomwe zimakhala ndi mitundu yambiri ya phukusi monga, kudzera m'mabowo, SMT, BGA, kugwirizanitsa waya, ndi kusindikiza zoyenera, poyerekeza ndi ENIG.
Kuphatikiza apo, kulimba kwabwino kwambiri komanso kukana kumapangitsa kuti ikhale ndi moyo wautali.Chovala chomizidwa chopyapyala chimapangitsa kuyika kwa magawo ndi kuwotcha kukhala kosavuta komanso kodalirika.Kuphatikiza apo, ENEPIG imapereka njira yodalirika ya Wire Bonding.
Zabwino:
• Easy pokonza
• Black Pad Free
• Pamwamba pake
• Moyo wabwino kwambiri wa alumali (miyezi 12+)
• Kulola maulendo angapo obwereza
• Zabwino kwa Zokutidwa Kupyolera mu Mabowo
• Zabwino kwa Fine Pitch / BGA / Small Components
• Zabwino pa Kukhudza Contact / Kankhani Contact
• Kudalirika Kwambiri Kumangirira Waya (golide/aluminiyamu) kuposa ENIG
• Kudalirika Kwambiri kwa Solder kuposa ENIG;Amapanga zolumikizira zodalirika za Ni/Sn
• Zimagwirizana kwambiri ndi ogulitsa Sn-Ag-Cu
• Kuyanika kosavuta
Zoyipa:
• Si onse opanga omwe angapereke.
• Kunyowa kumafunika kwa nthawi yayitali.
• Mtengo wapamwamba
• Kuchita bwino kumakhudzidwa ndi plating mikhalidwe
• Sizingakhale zodalirika pa mawaya agolide polumikizira ndi Soft Gold
Zomwe zimagwiritsidwa ntchito kwambiri:
High Density Assemblies, Complex kapena Mixed Package Technologies, High Performance Devices, Wire Bonding application, IC carrier PCBs, etc.
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Nthawi yotumiza: Feb-02-2023
